Road cross section lisp free download. 2 1.5 1 0.5 0 ゼ ロ ク ロ ス タ イ ム 秒 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 温度℃ 240 250 260 温度℃ 240 250 260 ゼ ロ ク ロ タ イ ム 秒 品名 特性 固形分量 塩素含有量 比重 (20℃) 備 考 es-1061 15% 0.07% 0.822 標準品、スルーホール基板に適する es-1061sp-2 15% 0.09% 0.826 es-1061. 千住金属工業のスパークルフラックス es-1061sp-2-50cc es-1061sp-2-50ccの選定・通販ページ。ミスミ他、国内外3,324メーカー、2,070万点以上の商品を1個から送料無料で配送。豊富なcadデータ提供。千住金属工業のスパークルフラックス es-1061sp-2-50cc es-1061sp-2-50ccを始め、fa・金型部品、工具・工場消耗品の.
Products | Physical Property | Features & Uses | |||||
---|---|---|---|---|---|---|---|
Solid Content (wt %) | Specific Gravity (20℃) | Viscosity (20℃)(cP) | Chlorine Content (%) | ||||
Resing Type | General Use | PO-F-1010S | 15 | 0.823 | 4.5 | 0.07 | Chip mounted & high density boards, standard type. |
PO-F-1010K | 17 | 0.825 | 4.1 | 0.07 | Prevention of dew condensation. | ||
ES-1061SP-2 | 15 | 0.826 | 4.0 | 0.09 | Pb-free soldering. | ||
Lower Residue | PO-F-009M | 9 | 0.807 | 3.2 | 0.06 | Chip mounted & high density boards, lower residue, spray coating. | |
PO-F-710 | 12 | 0.820 | 3 | 0.06 | Chip mounted & high density boards, spray coating, lower residue. | ||
RMA | SR-209 | 12 | 0.820 | 3.7 | *RMA | Lower residue, non-cleaning, lusterless type. | |
SR-12 | 12 | 0.818 | 3.6 | *RMA | Lower residue, non-cleaning. lustrous type. | ||
Water-Soluble Type | General Use | WF-2050 | 20 | 0.887 | 6.7 | 2.00 | High density electronic boards. |
Preliminary soldering of parts | WF-3041 | 46 | 1.156 | 6.1 | 0.000 | Soldering of nickel & copper based alloys, halogen-free. | |
Tinning Flux | T-a | 1 | 0.829 | 3.0 | 0.16 | Tinning for lead wire, negligible residues. |
* The procedure is similar to chlorides and bromides test.
There are many types of flux, depending on the required application and performance. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.
Sparkle Flux Es-1061sp-2
Products | Physical Property | Features & Uses | |||||
---|---|---|---|---|---|---|---|
Solid Content (wt %) | Specific Gravity (20℃) | Viscosity (20℃)(cP) | Chlorine Content (%) | ||||
Resing Type | General Use | PO-F-1010S | 15 | 0.823 | 4.5 | 0.07 | Chip mounted & high density boards, standard type. |
PO-F-1010K | 17 | 0.825 | 4.1 | 0.07 | Prevention of dew condensation. | ||
ES-1061SP-2 | 15 | 0.826 | 4.0 | 0.09 | Pb-free soldering. | ||
Lower Residue | PO-F-009M | 9 | 0.807 | 3.2 | 0.06 | Chip mounted & high density boards, lower residue, spray coating. | |
PO-F-710 | 12 | 0.820 | 3 | 0.06 | Chip mounted & high density boards, spray coating, lower residue. | ||
RMA | SR-209 | 12 | 0.820 | 3.7 | *RMA | Lower residue, non-cleaning, lusterless type. | |
SR-12 | 12 | 0.818 | 3.6 | *RMA | Lower residue, non-cleaning. lustrous type. | ||
Water-Soluble Type | General Use | WF-2050 | 20 | 0.887 | 6.7 | 2.00 | High density electronic boards. |
Preliminary soldering of parts | WF-3041 | 46 | 1.156 | 6.1 | 0.000 | Soldering of nickel & copper based alloys, halogen-free. | |
Tinning Flux | T-a | 1 | 0.829 | 3.0 | 0.16 | Tinning for lead wire, negligible residues. |
* The procedure is similar to chlorides and bromides test.
Es 1061sp 220
There are many types of flux, depending on the required application and performance. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.